Corsair has announced that it’s entering the DDR5 Workstation market today with the introduction of its WS DDR5 RDIMM memory kits, a new option for professional systems that are said to deliver uncompromising performance and reliability. Available in capacities of up to 256 GB, the new memory is compatible with the latest 4th Gen Intel Xeon and AMD Ryzen Threadripper 7000 processors, featuring frequencies of up to 6,400 MT/s.
Capacities include:
- 4x 16 GB kits (64 GB)
- 8x 16 GB kits (128 GB)
- 4x 32 GB kits (128 GB)
- 8x 32 GB kits (256 GB)
A look at the front and back of the memory:
Corsair on its new memory:
This new range of memory kits boasts capacities of up to 256GB, setting a new standard for memory-intensive tasks such as high-resolution media editing, 3D rendering, and AI training. Rigorously tested and carefully screened, these modules surpass JEDEC specifications with tighter timings and higher frequencies, ensuring optimal performance for the most demanding workloads.
The DDR5 registered DIMMs (RDIMMs) support Error Correction Code (ECC), enabling real-time error detection and correction for consistently reliable data processing.This commitment to stability caters to the needs of workstation users who rely on uninterrupted performance for their professional endeavors.
Achieving optimal performance is straightforward thanks to support for Intel XMP 3.0 and AMD EXPO. A few clicks to load the faster profile in the UEFI BIOS is all that’s required to unleash incredible throughput on compatible hardware, making these DDR5 RDIMMs user-friendly while maintaining top-tier performance.
Understanding the diverse needs of professional users, CORSAIR offers a range of capacities, including 4x 16GB kits (64GB), 8x 16GB kits (128GB), 4x 32GB kits (128GB), and 8x 32GB kits for a massive 256GB of high-speed DDR5 memory. Frequencies reaching up to 6,400MT/s ensure abundant bandwidth to tackle the most resource-intensive tasks.
To help tackle the heat generated during the most intensive workloads, CORSAIR has integrated a PGS layer, efficiently distributing heat away from the Power Management Integrated Circuit (PMIC) and across the RDIMMs. This design ensures quality cooling and reliability even under the most demanding conditions.